3 edition of Novel three-dimensional vertical interconnect technology for microwave and RF applications found in the catalog.
Novel three-dimensional vertical interconnect technology for microwave and RF applications
by National Aeronautics and Space Administration, Glenn Research Center, National Technical Information Service, distributor in [Cleveland, Ohio], [Springfield, Va
Written in English
|Other titles||Novel three dimensional vertical interconnect technology for microwave and RF applications.|
|Statement||Kavita Goverdhanam, Rainee N. Simons, Linda P.B. Katehi.|
|Series||NASA/TM -- 1999-209043., NASA technical memorandum -- 209043.|
|Contributions||Simons, Rainee, 1949-, Katehi, Linda P. B., NASA Glenn Research Center.|
|The Physical Object|
This book presents and discusses alternatives to ordinary transmission lines for the design and implementation of advanced RF/microwave components in planar book is devoted to the analysis, study and applications of artificial transmission lines mostly implemented by means of a host line conveniently modified (e.g., with modulation of transverse dimensions, with etched patterns Author: Ferran Martin. Book Condition: Good+; Hardcover; Moderate edgewear and rubbing to the covers; Unblemished textblock edges; The endpapers and all text pages are bright and unmarked; The binding is tight with a straight spine; This book will be stored and delivered in a sturdy cardboard box with foam padding; Medium-Large Format (Quatro, " - " tall); Dark blue covers with title in blue lettering on a Price: $
Abstract. In this Chapter, packaging technology for microwave/millimetre wave chips and circuits is briefly reviewed. Electrical interconnections in chip level and in a multilayered substrate are depicted after a brief introduction to the design concept of advanced : Shyh-Jong Chung, Hao-Hui Chen. An Integration Technology for RF and Microwave Circuits Based on Interconnect Programming Laleh Rabieirad, Member, IEEE, Edgar J. Martinez, and Saeed Mohammadi, Senior Member, IEEE Abstract—A conﬁgurable integration technology suitable for implementing application speciﬁc radio-frequency (RF) and microwave circuits is presented.
This textbook presents a unified treatment of theory, analysis and design of microwave devices and circuits. It is designed to address the needs of undergraduate students of electronics and communi-cation engineering for a course in microwave engineering as well as those of the students pursuing courses in electronics science. Abstract. In this Chapter, basic concepts and generic models of sprial inductors implemented in microwave circuits are briefly reviewed. Challenging issues regarding analysis, design and improvement of integrated inductors are : Jean-Fu Kiang, Chi-Yu Peng.
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NOVEL THREE-DIMENSIONAL VERTICAL INTERCONNECT TECHNOLOGY FOR MICROWAVE AND RF APPLICATIONS Kavita Goverdhanam _,Rainee N. Simons 2, and Linda EB. Katehi t _Radiation Laboratory, EECS Department, University of Michigan, Ann Arbor, Michigan ZNASA, Glenn Research Center, Dynacs Group, Cleveland, Ohio In this paper, novel 3D interconnects suitable for applications in microwave and RF integrated circuit technology have been presented.
The interconnect fabrication process and design details are. Get this from a library. Novel three-dimensional vertical interconnect technology for microwave and RF applications.
[Kavita Goverdhanam; Rainee Simons; Linda P. In this paper, novel 3D interconnects suitable for applications in microwave and RF integrated circuit technology have been presented.
The interconnect fabrication process and design details are presented. In addition, measured and numerically modeled results of the performance of the interconnects have been shown.
Novel Technologies for Microwave and Millimeter-Wave Applications provides an overview of current research status in selected field, to facilitate a learning process from concepts to practices, from component design to system architecture, and from small scale to large scale.
Each chapter focuses on a topic and is organized to be self-sufficient. Contents in each chapter include concise. Abstract: A novel vertical interconnection utilizing finite ground coplanar waveguide (FGCPW) and silicon micromachining has been developed for W-band The measured results indicate insertion loss of only dB.
This transition uses standard processing techniques and is a compact, μm width and μm length, design. With this vertical interconnect, multiple IC layers may be connected to.
Click on the book chapter title to read more. A novel interconnect technology was reviewed, which was developed for three-dimensional (3-D) ultra-compact MMICs. Using O 2 /He RIE for the through hole and trench formation of a thick polyimide insulator layer, low-current electroplating for gold sidewall formation in the through-holes and the trenches, and ion-milling with WSiN metal stopper for gold patterning, a complete three-dimensional Cited by: 7.
Microwave Circulator Design, Second Edition by Douglas K. Linkhart. Ferrite circulators are a stone-age technology that has no replacement in today's solid-state world: you still need them.
An isolator does for RF, what a diode does for DC This book presents theory, information and design procedures to enable engineers and technicians to build circulators successfully. By developing an RF based three-dimensional micro-coaxial probe, its use as vertical interconnects in high frequency system-in-package technologies have considerably improved.
In this paper, novel low loss, wide-band coplanar stripline technology for radio frequency (RF)/microwave integrated circuits is demonstrated on high resistivity silicon wafer. In this work, a through wafer 3D vertical micro-coaxial probe that can be utilized in high frequency 3D system-in-packaging technologies and multi-layer systems has been developed as shown in figure 1.
The coaxial probe is designed with radio frequency (RF) criteria such that, the probe could be successfully integrated in the mm-wave systems Cited by: 1.
The Third Edition of Microwave and RF Design (A Multi-Volume Set), authored by Professor Michael Steer of North Carolina State University, is a comprehensive free OpenAccess electronic textbook focusing on RF systems is intended for advanced undergraduate and graduate students, as well as professionals.
interconnect . These different via technologies have found applications in three-dimensional (3-D) chip stacks , as a substrate coil inductor , microstrip substrate interconnect , and in MEMS , .
The novelty of our via technology is that it features an insulator liner and a solid metal core. Novel Technologies for Microwave and Millimeter-Wave Applications provides an overview of current research status in selected field, to facilitate a learning process from concepts to practices, from component design to system architecture, and from small scale to large scale.
Each chapter focuses on a topic and is organized to be self-sufficient. Contents in each chapter include concise Format: Hardcover.
This book presents a systems first approach to RF engineering design so that the reader learns to appreciate RF and microwave technology and design from this market-driven perspective. The book is organized around three modules that are largely independent but do build on each other and are best taught in sequence.4/5(3).
A. Sutono, A. Pham, J. Laskar, W.R. Smith, Development of three dimensional ceramic-based MCM inductors for hybrid RF microwave applications. IEEE Radio Frequency Integrated Circuits Symposium, Google ScholarAuthor: Khaled Salah, Yehea Ismail, Alaa El-Rouby. Using the newest CAD tools, the book shows how to design transistor and diode circuits, and also details CAD's usefulness in microwave integrated circuit (MIC) and monolithic microwave integrated circuit (MMIC) technology.
Applications of nonlinear SPICE programs, now available for microwave CAD, are described. Three-Dimensional Heterogeneous Integration for RF/Microwave Applications Joseph L. Wood (ABSTRACT) High performance RF/mixed signal systems require new interconnect strategies to combine high frequency (microwave/mm-wave) circuitry with silicon mixed-signal and baseband digital processing.
In such systems, heterogeneous vertical integration. This book provides a fundamental and practical introduction to radio frequency and microwave engineering and physical aspects of wireless communication In this book, the author addresses a wide range of radio-frequency and microwave topics with emphasis on physical aspects including EM and voltage waves, transmission lines, passive circuits Cited by: 8.
Interconnects for a Multi-layer Three-dimensional Silicon Architecture. As low cost and low volume gain increasing importance in today's technology market, the development of lateral and vertical interconnects for K- through W-band applications using silicon micromachining is a worthwhile endeavor.
Thus, lateral components appropriate for multi-layer applications, such as Wilkinson dividers, reactive tees .Novel Technologies for Microwave and Millimeter-Wave Applications provides an overview of current research status in selected field, to facilitate a learning process from concepts to practices, from component design to system architecture, and from small scale to large scale.
Each chapter focuses on a topic and is organized to be self-sufficient.Three-dimensional (3D) integration in a and Gutmann, R. J.: Wafer bonding of damascene-patterned metal/adhesive redistribution layers for via-first three-dimensional (3D) interconnect. In IEEE 55th R.
J.: Die-on-wafer and wafer level three-dimensional (3D) integration of heterogeneous IC technologies for RF-microwave-millimeter Cited by: 1.